Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer

Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45 degrees C to63.9 degrees C in the digital control equipment and 45 degrees C to 68.7 degrees C in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1 degrees C, which is allowed for engineering application.