Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

被引：13
|
作者：
Meinshausen, L. [1 ,2 ]
Fremont, H. [1 ]
Weide-Zaage, K. [2 ]
机构：
[1] Univ Bordeaux 1, Lab IMS, F-33405 Talence, France
[2] Leibniz Univ Hannover, Informat Technol Lab LFI, Hannover, Germany
来源：
MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 9-10期
关键词：
SN;
D O I：
10.1016/j.microrel.2012.06.127
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Because of material movements intermetallic compound layers are formed between metal layers and solder joints. These intermetallics affect the reliability of the solder joints by reducing their lifetime during drop test or by accelerating the migration induced void formation. This study investigates the migration kinetics of Cu, Ni, Au and Sn in SAC305 solder joints on three different metal layers: Cu, NiAu and NiP. The aim of this study is the identification and description of migration processes during aging of solder joints with one and double sided Ni diffusion barriers. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1827 / 1832
页数：6
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