3D analysis of advanced nano-devices using electron and atom probe tomography

被引:49
|
作者
Grenier, A. [1 ]
Duguay, S. [2 ]
Barnes, J. P. [1 ]
Serra, R. [1 ]
Haberfehlner, G. [1 ]
Cooper, D. [1 ]
Bertin, F. [1 ]
Barraud, S. [1 ]
Audoit, G. [1 ]
Arnoldi, L. [2 ]
Cadel, E. [2 ]
Chabli, A. [1 ]
Vurpillot, F. [2 ]
机构
[1] CEA, LETI, F-38054 Grenoble 9, France
[2] Univ Rouen, CNRS, UMR 6634, Grp Phys Mat, F-76801 St Etienne, France
关键词
Atom probe tomography; Tip shape simulation; Electron tomography; Quantification; Gate-all-around transistor; Tri-gate transistor; FIELD EVAPORATION; RECONSTRUCTION;
D O I
10.1016/j.ultramic.2013.10.001
中图分类号
TH742 [显微镜];
学科分类号
摘要
The structural and chemical properties of advanced nano-clevices with a three-dimensional (3D) architecture have been studied at the nanometre scale. An original method has been used to characterize gate-all-around and tri-gate silicon nanowire transistor by combining electron tomography and atom probe tomography (APT). Results show that electron tomography is a well suited method to determine the morphological structure and the dimension variations of devices provided that the atomic number contrast is sufficient but without an absolute chemical identification. APT can map the 3D chemical distribution of the atoms in devices but suffers from strong distortions in the dimensions of the reconstructed volume. These may be corrected using a simple method based on atomic density correction and electron tomography data. Moreover, this combination is particularly useful in helping to understand the evaporation mechanisms and improve APT reconstructions. This paper demonstrated that a full 3D characterization of nano-devices requires the combination of both tomography techniques. (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码:185 / 192
页数:8
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