Bottom anti-reflective coatings: Control of thermal processing

被引：7
|
作者：
Schiltz, A
Terpan, JF
Brun, S
Paniez, PJ
机构：
[1] France Telecom, CNET-Grenoble, F-38240 Meylan Cedex
来源：
MICROELECTRONIC ENGINEERING | 1996年 / 30卷 / 1-4期
关键词：
D O I：
10.1016/0167-9317(95)00246-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper investigates the thermal process conditions of the Bottom Anti-Reflective Layer for i-Line lithography (BARLi) using various characterization techniques such as TGA and WCM (Tg). The thermal modifications of the material are related to the variations in its functional properties, namely degree of solubility, absorption, thickness and reflectivity. A thermal process window is defined to obtain a maximum improvement from this technology.
引用
收藏
页码：283 / 286
页数：4
相关论文
共 50 条
  • [1] Wet developable bottom anti-reflective coatings
    Hatanaka, T
    Kimura, S
    Enomoto, T
    Nakajima, Y
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XXI, PTS 1 AND 2, 2004, 5376 : 655 - 663
  • [2] Photochemical studies on bottom anti-reflective coatings
    Guerrero, Douglas J.
    Mercado, Ramil
    Washburn, Carlton
    Meador, Jim
    JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2006, 19 (03) : 343 - 347
  • [3] Anti-reflective coatings
    Lamb, Jim
    European Semiconductor, 1995, 17 (02):
  • [4] Bottom anti-reflective coatings for DUV lithography: Determination of optimum thermal process conditions
    Schiltz, A
    Terpan, JF
    Amblard, G
    Paniez, PJ
    MICROELECTRONIC ENGINEERING, 1997, 35 (1-4) : 221 - 224
  • [5] Bottom anti-reflective coatings for DUV lithography: determination of optimum thermal process conditions
    France Telecom, Meylan, France
    Microelectron Eng, 1-4 (221-224):
  • [6] New 193nm bottom anti-reflective coatings
    Nakayama, K
    Kishioka, T
    Arase, SY
    Sakamoto, R
    Hiroi, Y
    Nakajima, Y
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XX, PTS 1 AND 2, 2003, 5039 : 920 - 928
  • [7] Compatibility of chemically amplified photoresists with bottom anti-reflective coatings
    Yoshino, H
    Itani, T
    Hashimoto, S
    Yamana, M
    Yoshii, T
    Tanabe, H
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XV, PTS 1 AND 2, 1998, 3333 : 655 - 665
  • [8] Organic ArF bottom anti-reflective coatings for immersion lithography
    Xiang, Zhong
    Zhuang, Hong
    Wu, Hengpeng
    Shan, Jianhui
    Abdallah, Dave
    Yin, Jian
    Mullen, Salem
    Yao, Huirong
    Gonzalez, Eleazar
    Neisser, Mark
    ADVANCES IN RESIST MATERIALS AND PROCESSING TECHNOLOGY XXIV, 2007, 6519
  • [9] Investigation on the thermal stability of reflective and anti-reflective coatings on freestanding GaNd
    Sun, Yuanhang
    Zhang, Yumin
    Wang, Miao
    Hu, Junjie
    Meng, Wenli
    Liang, Guosong
    Yi, Juemin
    Wang, Jianfeng
    Xu, Ke
    APPLIED PHYSICS EXPRESS, 2023, 16 (04)
  • [10] New material for 193-nm bottom anti-reflective coatings
    Weimer, M
    Krishnamurthy, V
    Fowler, S
    Nesbit, C
    Claypool, J
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XX, PTS 1 AND 2, 2003, 5039 : 866 - 871
12345