Hybrid Large-Area Systems: Challenges in Interfacing

被引：0

作者：

Moy, Tiffany ^{[1
]}

Wagner, Sigurd ^{[1
]}

Rieutort-Louis, Warren ^{[1
]}

Hu, Yingzhe ^{[1
]}

Huang, Liechao ^{[1
]}

Sanz-Robinson, Josue ^{[1
]}

Sturm, James C. ^{[1
]}

Verma, Naveen ^{[1
]}

机构：

[1] Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA

来源：

2016 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS) | 2016年

关键词：

large-area electronics (LAE); hybrid systems; thin-film sensors; thin-film transistors (TFTs); CMOS ICS; ELECTRONICS; SENSORS; SILICON;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Hybrid large-area systems aim to leverage the strengths of two complementary technologies: (1) large-area electronics (LAE), which enables dense arrays of diverse transducers on substrates that can be large and flexible; and (2) silicon CMOS ICs, which enable efficient and high-performance instrumentation, computation, and power management. A key challenge in realizing these hybrid systems on a large-scale lies in the interfacing required between the two technologies. We describe methods to ease the interfacing, enabled by device, circuit, and algorithmic advances, thereby suggesting a range of challenges and opportunities that are exposed when thinking about systems.

引用

页码：1374 / 1377

页数：4

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