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- [3] Ellipsometry characterization of copper complex layers for abrasive-free chemical mechanical polishing CHEMICAL MECHANICAL PLANARIZATION V, 2002, 2002 (01): : 176 - 183
- [5] Ultra-flat and ultra-smooth Cu surfaces produced by abrasive-free chemical-mechanical planarization/polishing using vacuum ultraviolet light PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2011, 35 (04): : 669 - 676
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- [7] Chemical-Mechanical Polishing For III-V Wafer Bonding Applications: Polishing, Roughness, And An Abrasive-Free Polishing Model SEMICONDUCTOR WAFER BONDING 11: SCIENCE, TECHNOLOGY, AND APPLICATIONS - IN HONOR OF ULRICH GOSELE, 2010, 33 (04): : 383 - 389
- [10] Abrasive-free Chemical Polishing of Hard Disk Substrate with Benzoyl Peroxide-H2O2 Slurry Design, Manufacturing and Mechatronics, 2014, 551 : 66 - 70