THE QUALITY OF CONTACT OF CONDUCTIVE AND RESISTIVE THICK FILM LAYERS

The presented work is concerned with problems of contact of thick film layers. Thick film technologies are used in electronic applications permanently. Low cost is one of the advantages of thick film technologies in high volumes production. The samples with structures of two different layers were prepared. Conductive and resistive path were deposited by using of polymer thick film pastes. Screen print technology was used for deposition of layers. Silver paste was used for conductive layers and carbon black paste for resistive layers. The contact resistance in interface of two layers represents parameter for quality evaluation. The three-wire method was used for measurement of contact of conductive and resistive layers. The influence of combination of different materials of conductive and resistive layers on contact quality was investigated.