Development of a new leadframe-type chip scale package

The explosive growth of high density and low cost electronic products have a tremendous impact on the electronic packaging industry. Recently, chip scale packaging(CSP) technology is proposed for higher density of IC packaging. A new low cost leadframe-type CSP has been developed and proved itself suitable for mass production. Instead of conventional transfer molding, a liquid epoxy dispension process is applied on a pre-dammed LOC-leadframe on which the bare chip was mounted and wire bonded in a LOC process. A seperated process is then used to finish the CSP package. Considering the CTE mismatch issue, this CSP package is more reliable than those with conventional transfer molding encapsulation. Due to short trace and exposure of IC chip, This CSP provides a better electrical and thermal performances. Besides, a pre-defined metal ring will also help to standardize the CSP's dimension.