The thermopile: An anisotropic temperature sensor

被引:4
|
作者
Thapa, Suvhashis [1 ]
Tangutooru, Siva Mahesh [2 ]
Guilbeau, Eric J. [2 ]
Crews, Niel D. [1 ]
机构
[1] Louisiana Tech Univ, Inst Micromfg, Ruston, LA 71270 USA
[2] Louisiana Tech Univ, Ctr Biomed Engn & Rehabilitat Sci, Ruston, LA 71270 USA
基金
美国国家科学基金会;
关键词
Thermopiles; Temperature sensors; Microfluidics; Temperature gradients; Common mode rejection; CALORIMETER; FLOW;
D O I
10.1016/j.sna.2012.08.006
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article discusses the operation of thermopiles when used under non-isothermal baseline conditions. Although isothermal baselines are the common thread among existing thermopile applications, this article demonstrates that these sensors can also be used to detect subtle thermal events that are superimposed over much larger steady-state or transient temperature gradients. The larger temperature variation will not contribute to the transduced voltage as long as specific thermal symmetry conditions are matched with a specific thermopile design. This article discusses this sensing anisotropy that corresponds to certain thermopile designs, and experimental results are presented which demonstrate the relative performance under several thermal conditions. Thermopile performance characteristics of baseline voltage, baseline drift and noise, and signal sensitivity have been compared experimentally for isothermal and high gradient conditions. When symmetry conditions were met, certain thermopile geometries exhibited a sensing anisotropy of more than 1000:1. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:132 / 140
页数:9
相关论文
共 50 条
  • [1] Room temperature thermopile THz sensor
    Ben Mbarek, Sofiane
    Euphrasie, Sebastien
    Baron, Thomas
    Thiery, Laurent
    Vairac, Pascal
    Cretin, Bernard
    Guillet, Jean-Paul
    Chusseau, Laurent
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2013, 193 : 155 - 160
  • [2] Room temperature Si–Ti thermopile THz sensor
    Sofiane Ben Mbarek
    Sébastien Euphrasie
    Thomas Baron
    Laurent Thiery
    Pascal Vairac
    Danick Briand
    Jean-Paul Guillet
    Laurent Chusseau
    [J]. Microsystem Technologies, 2015, 21 : 1627 - 1631
  • [3] Design and fabrication of a temperature sensor based on thermopile in CMOS technology
    Voiculescu, I
    Zaghloul, M
    McGill, RA
    [J]. MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) - 2003, 2003, : 597 - 601
  • [4] Room temperature Si-Ti thermopile THz sensor
    Ben Mbarek, Sofiane
    Euphrasie, Sebastien
    Baron, Thomas
    Thiery, Laurent
    Vairac, Pascal
    Briand, Danick
    Guillet, Jean-Paul
    Chusseau, Laurent
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (08): : 1627 - 1631
  • [5] A Novel Infrared Temperature Measurement with Dual Mode Modulation of Thermopile Sensor
    Shen, Chih-Hsiung
    Chen, Shu-Jung
    Guo, Yi-Ting
    [J]. SENSORS, 2019, 19 (02):
  • [6] CU/PD THIN-FILM THERMOPILE AS A TEMPERATURE AND HYDROGEN SENSOR
    BACIOCCHI, M
    BEARZOTTI, A
    GENTILI, M
    LUCCHESINI, A
    CALIENDO, C
    VERONA, E
    DAMICO, A
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 1990, 22 (1-3) : 631 - 635
  • [7] Wire-bonding process monitoring using thermopile temperature sensor
    Suman, S
    Gaitan, M
    Joshi, Y
    Harman, GG
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (04): : 685 - 693
  • [8] Temperature Difference Sensor to Monitor the Temperature Difference in Processor Active Heat Sink Based on Thermopile
    Markowski, Piotr Marek
    Gierczak, Miroslaw
    Dziedzic, Andrzej
    [J]. ELECTRONICS, 2021, 10 (12)
  • [9] The Research of Temperature Compensation for Thermopile Sensor Based on Improved PSO-BP Algorithm
    Li, Yuanjiang
    Li, Yuehua
    Li, Feng
    Zhao, Bin
    Li, QingQing
    [J]. MATHEMATICAL PROBLEMS IN ENGINEERING, 2015, 2015
  • [10] Measurement of Core Body Temperature Using Graphene-Inked Infrared Thermopile Sensor
    Chaglla, Jorge S. E.
    Celik, Numan
    Balachandran, Wamadeva
    [J]. SENSORS, 2018, 18 (10)