Virtual laboratory support for microelectronics packaging education

被引：10
|
作者：
Illyefalvi-Vitéz, Z [1 ]
Németh, P [1 ]
Pinkola, J [1 ]
Ripka, G [1 ]
Ruszinkó, M [1 ]
机构：
[1] Tech Univ Budapest, Dept Elect Technol, H-1111 Budapest, Hungary
来源：
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS | 1999年
关键词：
D O I：
10.1109/ECTC.1999.776321
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The development of information technology has opened new perspectives in electronics packaging education to prepare engineers for the needs of the 21st century. A project for the creation of virtual laboratory environment in the field of microelectronics packaging is proposed and outlined in this paper. Educational courses for undergraduate students and working engineers can use the proposed virtual laboratories through the internet in order to support their training and extend their skills into emerging fields.
引用
收藏
页码：1068 / 1073
页数：6
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