Research on Thermal Interface Materials for Power LED Package

被引：0
|
作者：
Liu, Wei [1 ]
Ma, Jun [2 ]
Lin, Qingping [2 ]
机构：
[1] Shenzhen Huizhi Optoelect Technol Co Ltd, Gen ManAgers Off, Shenzhen, Peoples R China
[2] PKU, Dept Microelect & Solid Elect, Shenzhen Grad Sch, Shenzhen, Peoples R China
来源：
2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2020年
基金：
中国国家自然科学基金;
关键词：
LED package; bonding process; interfacial; IMCs;
D O I：
10.1109/icept50128.2020.9202565
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Aiming at the special application of HP LED packAge, Sn96.5Ag3Cu0.5 and SnSb10Ni0.5 die bonding solder paste were developed, and the die bonding process, microstructure of die bonding interface and its service efficiency were investigated in detail. The results showed that the microstructure of the Solder-bonding interface is uNiform, and there is no obvious cavity and crack. After Aging, the microstructure of the interface is relatively stable, and there is no obvious iNitiation and growth of crack and void. The results indicated that the thermal stability of solder bonding interface is better, which can effectively make up for the deficiencies of eutectic welding and silver glue die-bonding technology, and is expected to become a low-cost and feasible HP LED solid crystal technology.
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页数：4
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