Looking Ahead for Resistive Memory Technology A broad perspective on ReRAM technology for future storage and computing

被引:26
|
作者
Li, Hai [1 ,2 ,3 ,4 ,5 ]
Chen, Yiran [6 ,7 ]
Liu, Chenchen [1 ]
Strachan, John Paul [8 ]
Davila, Noraica [8 ]
机构
[1] Univ Pittsburgh, Dept Elect & Comp Engn, Pittsburgh, PA 15260 USA
[2] Qualcomm Inc, San Diego, CA USA
[3] Intel Corp, Santa Clara, CA 95051 USA
[4] Seagate Technol, Cupertino, CA USA
[5] NYU, Polytech Inst, New York, NY 10003 USA
[6] Univ Pittsburgh, Pittsburgh, PA 15260 USA
[7] Dept Elect & Comp Engn, Evolutionary Intelligence Lab, Pittsburgh, PA USA
[8] Hewlett Packard Labs, Palo Alto, CA USA
关键词
D O I
10.1109/MCE.2016.2614523
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Resistive random-access memory (ReRAM) is regarded as one of the most promising alternative nonvolatile memory technologies for its advantages in very-high-storage density, simple structure, low power consumption, and long endurance, as well as good compatibility with traditional complimentary metal-oxide-semiconductor (CMOS) technology. In addition to the data storage, ReRAM can also be used for logic operation and computation, demonstrating a great potential in developing a non-von Neumann computing system. Extensive studies on ReRAM technology, including material, device process, cell and array structure, circuit, and architecture, have been conducted in recent years. In this article, we provide a broad perspective on ReRAM technology for future storage and computing. The models, challenges, and applications are also summarized. © 2012 IEEE.
引用
收藏
页码:94 / 103
页数:10
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