Electrical Characteristics of Flip-Chip Package Interconnection

被引：0
|
作者：
Li, Hongbin [1 ]
Zhao, Quanming [1 ]
Zuo, Panpan [1 ]
机构：
[1] Hebei Univ Technol, Sch Elect & Informat Engn, Tianjin, Peoples R China
来源：
2016 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC) | 2016年
关键词：
flip-chip package; interconnection; crosstalk; locally matching;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An investigation of flip-chip package interconnection over a wideband frequency up to 100GHz is presented in this paper. Different packages are modeled and simulated to determine the electromagnetic characteristics of flip-chip package interconnection. The electrical crosstalk has been investigated at high frequency between two flip-chip models which are separated by 0.6-0.8mm. The impact of multiple ground bump is investigated. Key to high return loss at the interconnection is a small bump diameter, multiple bumps do not improve the quality of the transition significantly. Applying simple locally matching technique, the transmission performance can be improved.
引用
收藏
页码：1003 / 1005
页数：3
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