Unpatterned surface inspection for next-generation devices

Three emerging needs of the semiconductor industry have necessitated a new paradigm in wafer inspection. These needs are the ability to detect defects at very small defect densities with higher sensitivity and tighter repeatability; to measure surface quality (haze) with higher sensitivity; and to inspect 300-mm wafers. This article discusses a new inspection technique that surpasses inspection requirements for new device generations. The system uses stationary, axially symmetric optics to detect defects with higher sensitivity and better repeatability in a low defect density environment.