Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder

被引：4
|
作者：
Tian, Jun [1 ,2 ,3 ]
Hong, Chunfu [2 ,3 ]
Hong, Lihua [2 ,3 ]
Yan, Xiaohui [2 ,3 ]
Dai, Pinqiang [1 ,2 ,3 ]
机构：
[1] Fuzhou Univ, Sch Mat Sci & Engn, Fuzhou, Fujian, Peoples R China
[2] Fujian Univ Technol, Sch Mat Sci & Engn, Fuzhou, Fujian, Peoples R China
[3] Fujian Prov Key Lab Adv Mat Proc & Applicat, Fuzhou, Fujian, Peoples R China
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2019年 / 48卷 / 05期
关键词：
Zn-20Sn alloy; high-temperature lead-free solder; corrosion resistance; interfacial reaction; shear strength; nano-indentation; INTERMETALLIC COMPOUNDS; ZN-SN; INTERFACIAL REACTIONS; CU; GROWTH; BEHAVIOR; ROUGHNESS;
D O I：
10.1007/s11664-018-06917-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Cerium-lanthanum mixed rare earth (RE) (0.5wt.%) was added to Zn-20Sn high-temperature lead-free solder to study the effect of RE on the solder properties. The Zn-20Sn-0.5RE solder has a better corrosion resistance than that of Zn-20Sn alloy. RE addition increases the gamma-Cu5Zn8 layer thickness, promotes growth of a epsilon-CuZn5 layer shaped like bamboo shoots, and increases the roughness of the epsilon-CuZn5 layer, which increases the shear strength of the solder joints. Compared with the Zn-20Sn alloy, the creep resistance of the Zn-20Sn-0.5RE solder was improved after soldering. The indentation hardness increases in an order of Zn-20Sn-0.5RE solder, Zn-20Sn solder, epsilon-CuZn5 layer, and gamma-Cu5Zn8 layer.
引用
收藏
页码：2685 / 2690
页数：6
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