Microscale computational simulation and experimental measurement of thermal residual stresses in glass-alumina functionally graded materials

被引:41
|
作者
Cannillo, V
Montorsi, M
Siligardi, C
Sola, A
de Portu, G
Micele, L
Pezzotti, G
机构
[1] Univ Modena, Dipartimento Ingn Mat & Ambiente, I-41100 Modena, Italy
[2] Inst Sci & Technol Ceram, I-48018 Faenza, Italy
[3] Kyoto Inst Technol, Ceram Phys Lab, Res Inst Nanosci, Sakyo Ku,8585, Kyoto 606, Japan
关键词
microstructure; mechanical properties; thermal expansion; Al2O3; glass;
D O I
10.1016/j.jeurceramsoc.2005.02.012
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Glass-alumina functionally graded materials are new attractive composite materials, that can achieve peculiar mechanical properties due to their gradual compositional variation. Nevertheless, the difference between the coefficients of thermal expansion of the constituent phases may result in significant thermal residual stresses in service or during fabrication. A proper (glass formulation can minimize the mismatch in thermo-mechanical properties, thus relevantly reducing the mean value of the resultant thermal stresses. However, it is a crucial requirement to evaluate the effect of microstructural discreteness and randomness oil the actual stress distribution in functionally graded materials. With this aim,a computational model which applies the finite element method at the microscale is used. The careful modelling of the real microstructural details enables to accurately predict the local stress values and distribution. In order to verify the reliability of the computational simulations, the residual thermal stresses were also experimentally measured by means of a piezo-spectroscopic technique. The comparison between the numerical and the experimental results validate the microstructure-based model. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1411 / 1419
页数:9
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