Understanding Metal Oxide RRAM Current Overshoot and Reliability Using Kinetic Monte Carlo Simulation

被引:0
|
作者
Yu, Shimeng [1 ]
Guan, Ximeng
Wong, H. -S. Philip
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
来源
2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2012年
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A Kinetic Monte Carlo (KMC) numerical simulator is developed for metal oxide resistive random access memory (RRAM). In this work, substantial improvements are made on the stochastic model in [1] by including multiple conduction mechanisms, local field and local temperature profile, and tracking of the individual oxygen migration path. The improved simulator shows extended capability to study a full set of RRAM characteristics such as set/forming current overshoot, endurance, and retention, etc. The simulations suggest that 1) eliminating the forming process and decreasing the parasitic capacitance is required for minimizing the overshoot effect and reducing the reset power consumption; 2) the degradation of endurance can be explained by oxygen escaping from the electrode during cycling; 3) the oxygen migration barrier can be extracted from the retention baking test over a suitable temperature range.
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页数:4
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