Active Thermomechanical Stress Cancellation o Solder Joints in Surface-Mount Technology Integrated Circuits

One of the main difficulties that prevent the use of integrated circuits (ICs) with ball grid array packages in space is the early fatigue of their solder joints. Early solder fatigue originates in the thermomechanical stress cycles produced by the different coefficients of thermal expansion (CTEs) of the printed circuit board and the IC package and the temperature fluctuations that they suffer during a space mission. In this paper, we propose an active cancellation mechanism to extend the lifetime of the solder joints with minimum energy consumption and show the simulation results from its modeling.