Whole-field strain analysis and damage assessment of adhesively bonded patch repair of CFRP laminates using 3D-DIC and FEA

被引：79
|
作者：
Kashfuddoja, Mohammad [1 ]
Ramji, M. [1 ]
机构：
[1] Indian Inst Technol Hyderabad, Dept Mech Engn, Engn Opt Lab, Yeddumailaram 502205, India
来源：
COMPOSITES PART B-ENGINEERING | 2013年 / 53卷
关键词：
Digital image correlation (DIC); Carbon fiber; Finite element analysis (FEA); HOLE TENSILE SPECIMENS; COMPOSITE; PANELS;
D O I：
10.1016/j.compositesb.2013.04.030
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The problem of damage evolution in composite structures, the way it propagates, performance and behavior is of paramount importance in utilizing them for structural applications. In the present work, an experimental study is carried out using digital image correlation (DIC) technique to analyze the behavior of adhesively bonded patch repair of carbon/epoxy unidirectional composite laminates under tensile loading. The damaged panel is repaired with both double and single sided circular patch made of same parent material. Damage initiation and propagation in notched and repaired panel as well as patch debonding is studied using 3D-DIC. Also a 3-D finite element analysis is carried out and obtained strain values are compared with the experimental prediction. They are found to be in good agreement. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码：46 / 61
页数：16
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