The energy influx during plasma deposition of amorphous hydrogenated carbon films

被引:15
|
作者
Rohde, D
Pecher, R
Kersten, H
Jacob, W
Hippler, R
机构
[1] Univ Greifswald, Inst Phys, D-17489 Greifswald, Germany
[2] Max Planck Inst Plasma Phys, Ctr Interdisciplinary Plasma Sci, D-85748 Garching, Germany
来源
SURFACE & COATINGS TECHNOLOGY | 2002年 / 149卷 / 2-3期
关键词
a-C : H; carbon films; energy influx; magnetron sputtering; deposition;
D O I
10.1016/S0257-8972(01)01497-9
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The integral energy influx from the plasma to the substrate was determined for amorphous hydrogenated carbon (a-C:H) film deposition by magnetron sputtering and in an electron cyclotron resonance (ECR) discharge. The measurements, for which a thermal probe was designed, are based on time evolution of the substrate temperature during the deposition process. The different contributions to the integral energy influx were estimated by model calculations on the basis of assumptions for the kinetic energy of the charge carriers, their recombination, and film condensation. The energy influx during deposition in the CH4-ECR plasma, which is in the range of 0.5-2 J s(-1), is predominantly determined by ions and chemical reactions, while the energy influx in magnetron sputtering, being in the range of 0.2-1.2 J s(-1), is mainly determined by fast neutrals and target radiation. e present results emphasise that the energy influx is a key parameter in thin film deposition and is important for comparison and scaling-up of different plasma process systems. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:206 / 216
页数:11
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