Unit process life cycle inventory: Comparisons of a new core-shell Cu-Ag nanoparticle interconnect technology with reflow soldering

被引：0
|
作者：
Kammer, Milea J. [1 ]
Handwerker, Carol A. [1 ]
Zhao, Fu [2 ,3 ]
机构：
[1] Purdue Univ, Dept Mat Sci & Engn, W Lafayette, IN 47907 USA
[2] Purdue Univ, Dept Mech Engn, W Lafayette, IN 47907 USA
[3] Purdue Univ, Div Environm & Ecol Engn, W Lafayette, IN 47907 USA
来源：
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 2013年 / 246卷
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
129-ENVR
引用
收藏
页数：1
相关论文
共 10 条
  • [1] Optimization of Cu-Ag Core-Shell Solderless Interconnect Paste Technology
    Kammer, Milea J.
    Muza, Anthony
    Snyder, John
    Rae, Alan
    Kim, Suk Jun
    Handwerker, Carol A.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (07): : 910 - 920
  • [2] Low temperature brazing nickel with Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes
    Xue, Songbai (xuesb@nuaa.edu.cn), 1600, Elsevier Ltd (721):
  • [3] Low Low temperature brazing nickel with Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes
    Ma, Chaoli
    Xue, Songbai
    Bridges, Denzel
    Palmer, Zane
    Feng, Zhili
    Hu, Anming
    JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 721 : 431 - 439
  • [4] Sintering mechanism of the Cu-Ag core-shell nanoparticle paste at low temperature in ambient air
    Tian, Yanhong
    Jiang, Zhi
    Wang, Chenxi
    Ding, Su
    Wen, Jiayue
    Liu, Zhiquan
    Wang, Chunqing
    RSC ADVANCES, 2016, 6 (94): : 91783 - 91790
  • [5] Sintering of multiple Cu-Ag core-shell nanoparticles and properties of nanoparticle-sintered structures
    Wang, Jiaqi
    Shin, Seungha
    RSC ADVANCES, 2017, 7 (35): : 21607 - 21617
  • [6] Oxidation-resistant Cu-Ag Core-shell Nanoparticle Paste for High Temperature Electronic Packaging
    Liu, Jiaxin
    Mon, Yun
    Peng, Yang
    Chen, Mingxiang
    ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
  • [7] Insight into the shell-dependent sintering behavior of Cu-Ag core-shell nanoparticle from molecular dynamics simulation
    Zhang, Zhonghua
    Li, Shizhen
    Liu, Yang
    JOURNAL OF MATERIALS SCIENCE, 2023, 58 (32) : 13059 - 13079
  • [8] Multi-particle molecular dynamics simulation: shell thickness effects on sintering process of Cu-Ag core-shell nanoparticles
    Shizhen Li
    Yang Liu
    Fenglian Sun
    Hongyuan Fang
    Journal of Nanoparticle Research, 2021, 23
  • [9] Multi-particle molecular dynamics simulation: shell thickness effects on sintering process of Cu-Ag core-shell nanoparticles
    Li, Shizhen
    Liu, Yang
    Sun, Fenglian
    Fang, Hongyuan
    JOURNAL OF NANOPARTICLE RESEARCH, 2021, 23 (01)
  • [10] Screen-Printable Cu-Ag Core-Shell Nanoparticle Paste for Reduced Silver Usage in Solar Cells: Particle Design, Paste Formulation, and Process Optimization
    Deng, Mengmeng
    Subramanian, Vivek
    ACS APPLIED ELECTRONIC MATERIALS, 2022, 4 (10) : 4929 - 4935
1