Development of a wireless active system for TPS structural health monitoring

被引：0
|
作者：
Giurgiutiu, V [1 ]
Xu, BL
Chung, J
Laskis, J
机构：
[1] Univ South Carolina, Dept Mech, Columbia, SC 29208 USA
[2] Global Contour Ltd, Rockwall, TX 75087 USA
来源：
REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 25A AND 25B | 2006年 / 820卷
关键词：
structural health monitoring; piezoelectric wafer active sensors; TPS; harsh environment;
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
This paper presents how active SHM principles could be applied for the detection and monitoring of critical TPS damage. Several essential aspects are being studied: (a) development of high temperature piezoelectric wafer active sensor (HT-PWAS) that can survive the harsh environment to which the TPS are exposed; (b) development of active SHM (pitch-catch, pulse-echo, phased-array, electromechanical impedance) that can be applied to TPS; (c) development of self-powering low-power consumption electronics with wireless transceiving capabilities.
引用
收藏
页码：1764 / 1771
页数：8
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