Patterning and electrical testing of field emission arrays with novel emitter geometries.

Fabrication technology for Cu microtips with high aspect ratio, where microtip height is similar to 6.5-7.5 mu m and microtip density in the active area is similar to 2.88 x 10(6) tips/cm(2) via lift-off method is experimentally confirmed. We investigated the possibility to increase emission uniformity though introduction of alpha-Si multi-resistors into microtips. We establish that reduction of fluctuation currents can be achieved with 300-350 Angstrom thick SiC coating over the microtips. We looked into emission properties of Cu microtips with doom-shaped Ti apex.