Mechanical properties of adhesives for bonding wood-A review

被引:196
|
作者
Stoeckel, Frank [1 ,3 ]
Konnerth, Johannes [2 ]
Gindl-Altmutter, Wolfgang [1 ,2 ]
机构
[1] Kompetenzzentrum Holz GmbH Wood K Plus, A-4040 Linz, Austria
[2] BOKU Univ Nat Resources & Life Sci, Inst Wood Technol & Renewable Mat, Dept Mat Sci & Proc Engn, A-3430 Tulln, Austria
[3] TU Braunschweig, Inst Bldg Mat Concrete Construct Fire Protect & O, D-38102 Braunschweig, Germany
关键词
Wood adhesives; Mechanical properties; Nanoindentation; Moisture; Temperature; UREA-FORMALDEHYDE RESINS; PHENOL-FORMALDEHYDE; STRAIN DISTRIBUTION; ELASTIC PROPERTIES; CURING CONDITIONS; PHYSICAL ASPECTS; POLYMER-FILMS; SENSING INDENTATION; THERMAL-STABILITY; ANALYTICAL-MODELS;
D O I
10.1016/j.ijadhadh.2013.03.013
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
In this review the current state of the art on mechanical properties of pure wood adhesives is summarised and discussed. Conventionally, mechanical adhesive properties were characterised by means of macroscopic tensile or bending tests of ex-situ cured adhesive films. More recently, nanoindentation was also used to characterise such ex-situ specimens, but more importantly, this method allows the mechanical characterisation of adhesive bond lines in-situ. Mechanical tests reveal high variability between, but notably also within specific groups of adhesives. For example, the modulus of elasticity covers a wide range of more than two magnitudes ranging from 0.1 GPa up to 15 GPa. Significant differences in adhesive stiffness were observed for adhesives intended to be used for solid wood products compared to wood based composite adhesives, the latter showing higher modulus values. In addition to mechanical adhesive properties as such, factors possibly influencing adhesive performance such as temperature, humidity or ageing of the bonds are taken into consideration. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码:32 / 41
页数:10
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