Applications of synchrotron X-rays in microelectronics industry research

被引:6
|
作者
Jordan-Sweet, JL
Detavernier, C
Lavoie, C
Mooney, PM
Toney, MF
机构
[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
[2] IBM Corp, Almaden Res Ctr, San Jose, CA 95120 USA
关键词
microelectronics materials; X-ray diffraction; synchrotron; nickel silicide; strained silicon; nanoparticles;
D O I
10.1016/j.nimb.2005.07.031
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
The high flux and density of X-rays produced at synchrotrons provide the microelectronics industry with a powerful probe of the structure and behavior of a wide array of solid materials that are being developed for use in devices of the future. They also are of great use in determining why currently-used materials and processes sometimes fail. This paper describes the X20 X-ray beamline facility operated by IBM at the National Synchrotron Light Source, and presents a series of three industry challenges and results that illustrate the variety of techniques used and problems addressed. The value of this research ranges from solving short-term, technically specific problems to increasing our academic understanding of materials in general. Techniques discussed include high-resolution diffraction, time-resolved diffraction, texture measurements, and grazing-incidence diffraction. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:247 / 252
页数:6
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