Millimeter-Wave Antenna in Package on Low-Cost Organic Substrate for Flip Chip Chip Scale (FCCSP) package

This work proposes a broadband microstrip patch antenna array with H-shaped aperture-coupled stacked rectangular patches is implemented to low-cost and low-loss organic substrate for flip chip chip scale (FCCSP) package for millimeter-wave antenna in package (AiP) application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip chip scale (FCCSP) package. The return loss of < -10 dB bandwidth of the proposed antenna array is from 55 to 69 GHz, which covers the requirement of IEEE 802.11ad standard. The cross-polarization levels in both and planes are better than 30 dB. The front-to-back ratio of the antenna radiation pattern is better than 20 dB. The prospoed microstrip patch antenna can achieve a wide bandwidth, low cross-polarization levels, low backward radiation levels, and easy integration with radio frequency (RF) circuits. This work provides a cost-effective approach for fifth-generation mobile communications (5G), IEEE 802.11ad, such as smart phone, laptops, and wireless router.