Tribological and electrical properties of nanocrystalline Cu films deposited by DC magnetron sputtering with varying temperature

被引:12
|
作者
Geetha, M. [2 ]
Kumar, N. [1 ]
Panda, K. [1 ]
Dhara, S. [1 ]
Dash, S. [1 ]
Panigrahi, B. K. [1 ]
Tyagi, A. K. [1 ]
Jayavel, R. [3 ]
Kamaraj, V. [2 ]
机构
[1] Indira Gandhi Ctr Atom Res, Kalpakkam 603102, Tamil Nadu, India
[2] Anna Univ, Dept Ceram Technol, Madras 600025, Tamil Nadu, India
[3] Anna Univ, Ctr Nanosci & Technol, Madras 600025, Tamil Nadu, India
关键词
Cu films; Tribological properties; Electrical conductivity; COPPER THIN-FILMS; MICROSTRUCTURE EVOLUTION; SUBSTRATE-TEMPERATURE; ROOM-TEMPERATURE; MECHANISMS; COATINGS; INDENTATION; DESIGN; LAYER;
D O I
10.1016/j.triboint.2012.10.006
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Cu films were deposited on Si substrates by direct current (DC) magnetron sputtering at three different substrate temperatures such as room temperature (RT), 100 degrees C and 200 degrees C. Possible mechanisms for substrate temperature dependent microstructure evolution in Cu films are discussed in this paper. Enhanced mechanical properties such as high hardness, high elastic modulus, low friction coefficient and high wear resistance of the films were obtained at deposition temperature of 100 degrees C. However, high friction coefficient as well as high wear rate was measured in films deposited at room temperature and 200 degrees C. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:79 / 84
页数:6
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