Three-dimensional, W-band circuits using Si micromachining

被引：0
|
作者：
Henderson, RM [1 ]
Weller, TM [1 ]
Katehi, LPB [1 ]
机构：
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
来源：
1999 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4 | 1999年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.
引用
收藏
页码：441 / 444
页数：4
相关论文
共 50 条
  • [1] W-band Three-Dimensional Surveillance Imaging System
    Cheng, Hang
    Zheng, Haitao
    Yu, Liechen
    Liu, Shuang
    Li, Shiyong
    Sun, Houjun
    2015 ASIA-PACIFIC MICROWAVE CONFERENCE (APMC), VOLS 1-3, 2015,
  • [2] Three-dimensional near-field surveillance imaging using W-band system
    Cheng Hang
    Zheng Hai-Tao
    Ting Han-Dan
    Li Shi-Yong
    Sun Hou-Jun
    JOURNAL OF INFRARED AND MILLIMETER WAVES, 2017, 36 (04) : 408 - 414
  • [3] Derivation and Validation of Three-Dimensional Microwave Imaging Using a W-Band MIMO Radar
    Kim, Sumin
    Kim, Jeongbae
    Chung, Chaerin
    Ka, Min-Ho
    IEEE TRANSACTIONS ON GEOSCIENCE AND REMOTE SENSING, 2022, 60
  • [4] Three-dimensional design of the coupling slot for a W-band output structure
    Song, L
    Luhmann, NC
    Scheitrum, G
    Arfin, B
    TWENTY SEVENTH INTERNATIONAL CONFERENCE ON INFRARED AND MILLIMETER WAVES, CONFERENCE DIGEST, 2002, : 351 - 352
  • [5] Three-Dimensional Interconnection With Magnetically Coupled Transition for W-Band Integration Applications
    Sun, Jian Xu
    Cheng, Yu Jian
    Wang, Lei
    Fan, Yong
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2023, 71 (01) : 112 - 121
  • [6] Complex three-dimensional structures in Si{100} using wet bulk micromachining
    Pal, Prem
    Sato, Kazuo
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 19 (10)
  • [7] Three-dimensional particle-in-cell calculations of an over-moded W-BAND gyrotron
    Watrous, JJ
    Frese, MH
    Luginsland, JW
    PPC-2003: 14TH IEEE INTERNATIONAL PULSED POWER CONFERENCE, VOLS 1 AND 2, DIGEST OF TECHNICAL PAPERS, 2003, : 463 - 466
  • [8] Design and three-dimensional beam/circuit interaction simulation of W-band folded waveguide SWS
    Vacuum Electronics National Laboratory, Beijing Vacuum Electronics Research Institute, Beijing 100016, China
    Tien Tzu Hsueh Pao, 2006, SUPPL. (2342-2346):
  • [9] A Broadband On-chip Power Divider up to W-band with Three-dimensional Three-coupled Lines
    Trung-Sinh Dang
    Nhut-Tan Doan
    Kim, Byung-Sung
    Kim, Nam-Yoon
    Kim, Chang-Woo
    Yoon, Sang-Woong
    JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, 2018, 18 (01) : 36 - 41
  • [10] Microfabrication Methods for W-band TWT Circuits
    Cook, Alan M.
    Joye, Colin D.
    Albright, Benjamin S.
    Calame, Jeffrey P.
    Abe, David K.
    2016 IEEE INTERNATIONAL VACUUM ELECTRONICS CONFERENCE (IVEC), 2016,
12345