Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique

被引：0

作者：

Stoukatch, S. ^{[1
]}

Laurent, P. ^{[1
]}

Dricot, S. ^{[1
]}

Axisa, F. ^{[1
]}

Seronveaux, L. ^{[2
]}

Vandormael, D. ^{[2
]}

Beeckman, E. ^{[2
]}

Heusdens, B. ^{[3
]}

Destine, J. ^{[1
]}

机构：

[1] Univ Liege, EMMI Microsys, B-4000 Liege, Belgium

[2] SIRRIS, Collect Ctr Belgium Technol Ind, B-4102 Liege, Belgium

[3] TAIPRO Engn, B-4102 Seraing, Belgium

来源：

2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) | 2012年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We evaluated suitability of AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques used for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding technique. We also evaluated suitability of AJP silver layer for surface-mount technology (SMT). We performed electrical characterization of the AJP silver layer. We realized a fully functional working prototype of Autonomous Wireless Sensor Node system using AJP silver conductive track as an electrical interconnection.

引用

页数：5

共 45 条

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