Modeling of Directional Solidification in 2D and 3D Cases

被引:0
|
作者
Ovrutsky, A. M. [1 ]
Rasshchupkyna, M. S. [1 ]
机构
[1] Dnepropetrovsk Natl Univ, UA-49050 Dnepropetrovsk, Ukraine
关键词
D O I
10.1134/S1063774508070201
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
A method of numerical solution of the directional solidification problem for sharp interfaces is developed. The cellular-structure development is analyzed by calculating the concentration fields and consecutive profiles of the solid-liquid interface. The anisotropy of growth rate and surface tension is taken into account. The wavelength ranges in which distortions develop are determined and the dependences of the rate of increase in the distortion amplitude on the wavelength are found. The results obtained for the 2D and 3D cases are compared with the known experimental and calculated data.
引用
收藏
页码:1208 / 1213
页数:6
相关论文
共 50 条
  • [1] Modeling of directional solidification in 2D and 3D cases
    A. M. Ovrutsky
    M. S. Rasshchupkyna
    Crystallography Reports, 2008, 53 : 1208 - 1213
  • [2] 2D/3D VIRTUAL FACE MODELING
    Chung, SoonKee
    Bazin, Jean-Charles
    Kweon, Inso
    2011 18TH IEEE INTERNATIONAL CONFERENCE ON IMAGE PROCESSING (ICIP), 2011, : 1097 - 1100
  • [3] 2D AND 3D VECTOR FORWARD MODELING
    JOHNSON, OG
    CHENG, TY
    WORLD OIL, 1983, 196 (05) : 218 - &
  • [4] Comparing of 2D and 3D modeling of MSM
    Bulva, J
    Szendiuch, I
    2005 Spanish Conference on Electron Devices, Proceedings, 2005, : 473 - 475
  • [5] Switching directional BLUs for full-resolution auto-stereoscopic 3D/2D and 2D/3D LCDs
    Kalantar, K.
    JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, 2017, 25 (04) : 266 - 276
  • [6] Directional BLU for full resolution field alternative auto-stereoscopic 3D/2D and 2D/3D LCDs
    Käläntär, K.K., 1600, Blackwell Publishing Ltd (45):
  • [7] Stochastic modeling of photoresist development in 2D and 3D
    Mack, Chris A.
    ADVANCES IN RESIST MATERIALS AND PROCESSING TECHNOLOGY XXVII, PTS 1 AND 2, 2010, 7639
  • [8] Choice between 2D and 3D electromagnetic modeling
    Cheng, Z
    Hu, Q
    Gao, S
    PROCEEDINGS OF THE FOURTH INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC FIELD PROBLEMS AND APPLICATIONS, 2000, : 90 - 93
  • [9] The Suppression of the Natural Convection in the Directional Solidification Processing of Superalloy by the Introduction of the Traveling Magnetic Field: 2D and 3D Simulation
    Qin, Ling
    Shen, Jun
    Fu, Hengzhi
    HIGH TEMPERATURE MATERIALS AND PROCESSES, 2016, 35 (09) : 881 - 893
  • [10] 2D or 3D?
    Mills, R
    COMPUTER-AIDED ENGINEERING, 1996, 15 (08): : 4 - 4