Induction diffusion brazing of copper to aluminium

被引：17
|
作者：
Wang, X. G. [1 ]
Yan, F. J. [2 ]
Li, X. G. [2 ]
Wang, C. G. [3 ]
机构：
[1] Dalhousie Univ, Dept Proc Engn & Appl Sci, Halifax, NS B3J 1Z1, Canada
[2] State Grid Shandong Elect Power Res Inst, Jinan 250002, Peoples R China
[3] Shandong Univ, Sch Mat Sci & Engn, Jinan 250061, Peoples R China
来源：
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING | 2017年 / 22卷 / 02期
关键词：
Copper; Aluminium; Diffusion brazing; Electrical resistivity; Microstructure; TO-COPPER; INTERMETALLIC COMPOUNDS; MECHANICAL-PROPERTIES; CONNECTIONS; TEMPERATURE; BEHAVIOR; JOINTS;
D O I：
10.1080/13621718.2016.1209625
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The aim of this research was to develop an induction diffusion brazing to obtain a sound joint between copper and aluminium. A foil interlayer was used to bond copper to aluminium at 600 degrees C for 2 s under a bonding pressure of 9 MPa. The failure of tensile test is in the aluminium side and no failure occurs when the joint is bent to 180 degrees. The electrical resistivity of joint is lower than that of aluminium. The interfacial intermetallic compounds layers are Cu9Al4 and CuAl2 with the total thickness of 2 mu m. No voids and oxide scale are found in the joint. Heat treatment shows that induction diffusion brazing is superior to conventional flash welding to maintain electrical stability and mechanical integrity of copper to aluminium joint.
引用
收藏
页码：170 / 175
页数：6
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