Traverse grinding characteristics of resin bond diamond wheel with new profile in precision grinding of silicon wafers

In traverse grinding compared with plunge grinding, concepts of wheel depth of cut and grinding width are not clear in definition, and then grain depth of cut can not be defined. By introduction of new wheel profile -front and rear tapers-, the above two concepts are defined and also truing accuracy required to give them physical meaning is discussed. Requirement in workshop such as stock removal per traverse of 10 to 20 mu m/pass and feed rate of 50 similar to 70 mm/min are achieved under the wheel depth of cut of 0.1 similar to 0.2 mu m/rev by applying resin bond diamond wheel with soft binder and concentration of 100.