Design guidelines for cable assemblies

被引:0
|
作者
Jorich, B [1 ]
Scata, B [1 ]
机构
[1] Nortech Syst, Commercial Wire Prod, Wayzata, MN USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:21 / 21
页数:1
相关论文
共 50 条
  • [1] EMI design of shielded cable assemblies
    Nadolny, Jim
    2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY: WORKSHOP AND TUTORIAL NOTES, VOLS 1-3, 2007, : 1172 - 1177
  • [2] The design and planning of cable harness assemblies
    Ng, FM
    Ritchie, JM
    Simmons, JEL
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2000, 214 (10) : 881 - 890
  • [3] Survey on the design and planning of cable harness assemblies in electromechanical products
    Yan, J.
    Zuo, D. W.
    Jiao, G. M.
    Li, J. P.
    E-ENGINEERING & DIGITAL ENTERPRISE TECHNOLOGY, 2008, 10-12 : 889 - +
  • [4] Cryoconnect cable assemblies
    不详
    AIRCRAFT ENGINEERING AND AEROSPACE TECHNOLOGY, 2007, 79 (02): : 222 - 222
  • [5] THEORY OF CABLE ASSEMBLIES
    Masahiro, Ai
    Nishioka, Takashi
    Report of the College of Engineering of Hosei University, 1983, (22): : 23 - 56
  • [6] Wire & cable & assemblies
    EE Prod News, 5 (59):
  • [7] Guidelines for design of guide-roller assemblies for mining conveyances
    Heyns, M
    Heyns, PS
    TRANSACTIONS OF THE INSTITUTION OF MINING AND METALLURGY SECTION A-MINING INDUSTRY, 1998, 107 : A137 - A145
  • [8] Design guidelines for anisotropic conductive adhesive assemblies in microelectronics packaging
    Chin, M.
    Hu, S. J.
    Barber, J. R.
    Electronic and Photonic Packaging, Integration and Packaging of MICRO/NANO/Electronic Systems, 2005, : 371 - 374
  • [9] Design guidelines for anisotropic conductive adhesive assemblies in microelectronics packaging
    Chin, Melida
    Hu, S. Jack
    Barber, James R.
    JOURNAL OF ELECTRONIC PACKAGING, 2008, 130 (02) : 0210061 - 0210063