Ultra-thin electronic device package

We report in this article a feasibility study of ultra-thin device packages that combine thin IC chips, thin flex circuit and adhesive flip chip technology. Using this novel packaging concept, we constructed a 512 kbyte SRAM memory modules that was less than 150 micron thick. Even more profoundly, the package was flexible enough to conform to non-planar surfaces. This unique property can lead to new applications that would not be feasible otherwise and extend the reach of electronics into brand new areas. Two of these ultra-thin modules were stacked to construct a 3D package with 1 Mbyte of memory capacity that is similar to 30 times thinner and 30 times lighter than a conventionally packaged device.