Stress Intensity Factors for Crack Problems in Bonded Dissimilar Materials

被引：0

作者：

Hamzah, Khairum ^{[1
,4
]}

Long, Nik Mohd Asri Nik ^{[1
,2
]}

Senu, Norazak ^{[1
,2
]}

Eshkuvatov, Zainidin ^{[3
]}

机构：

[1] Univ Putra Malaysia, Inst Math Res, Lab Computat Sci & Math Phys, Serdang 43400, Selangor, Malaysia

[2] Univ Putra Malaysia, Fac Sci, Math Dept, Serdang 43400, Selangor, Malaysia

[3] Univ Malaysia Terengganu, Fac Ocean Engn Technol & Informat, Kuala Terengganu 21030, Malaysia

[4] Univ Teknikal Malaysia Melaka, Fak Teknol Kejuruteraan Mekanikal & Pembuatan, Durian Tunggal 76100, Malaysia

来源：

JOURNAL OF ENGINEERING AND TECHNOLOGICAL SCIENCES | 2020年 / 52卷 / 05期

关键词：

complex variable function; bonded dissimilar materials; hypersingular integral equation; stress intensity factor; HALF-PLANES; MULTIPLE;

D O I：

10.5614/j.eng.technol.sci.2020.52.5.5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The inclined crack problem in bonded dissimilar materials was considered in this study. The system of hypersingular integral equations (HSIEs) was formulated using the modified complex potentials (MCP) function method, where the continuity conditions of the resultant force and the displacement are applied. In the equations, the crack opening displacement (COD) serves as the unknown function and the traction along the cracks as the right-hand terms. By applying the curved length coordinate method and the appropriate quadrature formulas, the HSIEs are reduced to the system of linear equations. It was found that the nondimensional stress intensity factors (SIF) at the crack tips depend on the ratio of elastic constants, the crack geometries and the distance between the crack and the boundary.

引用

页码：665 / 676

页数：12

共 50 条

[1] STRESS-INTENSITY FACTORS FOR CURVED CIRCULAR CRACK IN BONDED DISSIMILAR MATERIALS
CHEN, YZ
HASEBE, N
THEORETICAL AND APPLIED FRACTURE MECHANICS, 1992, 17 (03) : 189 - 196
[2] Mode III stress intensity factors in an interfacial crack in dissimilar bonded materials
A.R. Shahani
Archive of Applied Mechanics, 2006, 75 : 405 - 411
[3] Mode III stress intensity factors in an interfacial crack in dissimilar bonded materials
Shahani, AR
ARCHIVE OF APPLIED MECHANICS, 2006, 75 (6-7) : 405 - 411
[4] Stress intensity factors for the interface crack between dissimilar orthotropic materials
Yuuki, Ryoji
Xu, Jinquan
Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, 1991, 57 (539): : 1542 - 1549
[5] Stress intensity factor for an edge crack in two bonded dissimilar materials under convective cooling
Rizk, A. A.
THEORETICAL AND APPLIED FRACTURE MECHANICS, 2008, 49 (03) : 251 - 267
[6] Stress intensity factors for moving interfacial crack between bonded dissimilar fixed orthotropic layers
Das, S
Patra, B
COMPUTERS & STRUCTURES, 1998, 69 (04) : 459 - 472
[7] Accurate stress intensity factors for kinked interface crack in bonded dissimilar half-plane
Oda, Kazuhiro
Noda, Nao-Aki
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2021, 35 (14N16):
[8] STRESSES NEAR THE EDGE OF BONDED DISSIMILAR MATERIALS DESCRIBED BY 2 STRESS INTENSITY FACTORS
MUNZ, D
YANG, YY
INTERNATIONAL JOURNAL OF FRACTURE, 1993, 60 (02) : 169 - 177
[9] Stress intensity factors for an interface crack with impermeable surfaces between dissimilar electrostrictive materials
Yu H. Kim
Hyeon G. Beom
Archive of Applied Mechanics, 2010, 80 : 1287 - 1300
[10] Stress intensity factors for an interface crack with impermeable surfaces between dissimilar electrostrictive materials
Kim, Yu H.
Beom, Hyeon G.
ARCHIVE OF APPLIED MECHANICS, 2010, 80 (11) : 1287 - 1300

← 1 2 3 4 5 →