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- [2] Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links EURASIP Journal on Wireless Communications and Networking, 2020
- [4] Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point AOPC 2017: OPTICAL SENSING AND IMAGING TECHNOLOGY AND APPLICATIONS, 2017, 10462
- [5] Performance Analysis of Opportunistic Channel Bonding in Multi-Channel WLANs 2016 IEEE GLOBAL COMMUNICATIONS CONFERENCE (GLOBECOM), 2016,
- [6] Interface Properties of Thin Film Bonding by Low Melting Point Metal for MEMS devices IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 328 - +
- [9] BONDING ON SURFACES - THE SEXAFS POINT-OF-VIEW JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1993, 32 : 337 - 341