Performance Analysis of Interface Bonding and Channel Bonding at Point to Point

被引:2
|
作者
Shidik, G. F.
Noh, Z. A. B. M.
机构
[1] Dept. of Computer Science, Dian Nuswantoro University, UDINUS
[2] Dept. of ICT, Technical Malaysia Melaka University, UTeM
关键词
Channel Bonding; Interface Bonding; Point to Point; Wireless; 802.11n;
D O I
10.1109/TLA.2013.6502875
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this research, we have done the experiment by applying interface bonding and channel bonding techniques using Point to Point topology on wireless 802.11n to achieve greater performance of network transmission compare with normal wireless link. Some of parameters are used to measure the performance of the proposed methods, such as delay, jitter, data loss rate and throughput that applied on TCP/UDP protocols. Some of experiment setup such as Different Packet Sizes and Directional Traffic Flows also conducted to measures the capability of proposed methods. The results showed that Channel Bonding has significant throughput improvement when applied at Point to Point connection used wireless 802.11n by optimizing the available bandwidth. Different result is obtained with Interface Bonding where the performance transmission is lower than normal link.
引用
收藏
页码:633 / 635
页数:3
相关论文
共 50 条
  • [1] Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links
    Gonzalez-Jimenez, Jose Luis
    Dehos, Cedric
    Cassiau, Nicolas
    Siligaris, Alexandre
    Clemente, Antonio
    D'Errico, Rafaelle
    Savin, Valentin
    Durand, Yves
    De Domenico, Antonio
    Noguet, Dominique
    EURASIP JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING, 2020, 2020 (01)
  • [2] Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links
    José Luis Gonzalez-Jimenez
    Cédric Dehos
    Nicolas Cassiau
    Alexandre Siligaris
    Antonio Clemente
    Rafaelle D’Errico
    Valentin Savin
    Yves Durand
    Antonio De Domenico
    Dominique Noguet
    EURASIP Journal on Wireless Communications and Networking, 2020
  • [3] Thermal point bonding - Mechanism and fundamentals
    Davis, H
    Gilmore, TF
    Dharmadikhary, R
    1996 NONWOVENS CONFERENCE, 1996, : 119 - 122
  • [4] Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point
    Zhao Zhenli
    Mo Defeng
    Wu Jiarong
    Jiang Mengdie
    Zhang Jinglin
    Xu Lin
    AOPC 2017: OPTICAL SENSING AND IMAGING TECHNOLOGY AND APPLICATIONS, 2017, 10462
  • [5] Performance Analysis of Opportunistic Channel Bonding in Multi-Channel WLANs
    Han, Mengqi
    Khairy, Sami
    Cai, Lin X.
    Cheng, Yu
    2016 IEEE GLOBAL COMMUNICATIONS CONFERENCE (GLOBECOM), 2016,
  • [6] Interface Properties of Thin Film Bonding by Low Melting Point Metal for MEMS devices
    Yasuda, Kiyokazu
    Taniguchi, Katsumi
    Goto, Tomoaki
    Matsushima, Michiya
    Fujimoto, Kozo
    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 328 - +
  • [7] Protective bonding conductors: An IEC point of view
    Mitolo, Massimo
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2008, 44 (05) : 1317 - 1321
  • [8] BONDING MECHANISMS AND POINT-DEFECTS IN TIAL
    FU, CL
    YOO, MH
    INTERMETALLICS, 1993, 1 (01) : 59 - 63
  • [9] BONDING ON SURFACES - THE SEXAFS POINT-OF-VIEW
    ARVANITIS, D
    LEDERER, T
    COMELLI, G
    TISCHER, M
    YOKOYAMA, T
    TROGER, L
    BABERSCHKE, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1993, 32 : 337 - 341
  • [10] Three-Point Bending Behavior of Aluminum Foam Sandwich with Different Interface Bonding Methods
    Huang, Peng
    Sun, Xi
    Su, Xixi
    Gao, Qiang
    Feng, Zhanhao
    Zu, Guoyin
    MATERIALS, 2022, 15 (19)