Resonant Frequency Analysis for Spring-mass Structure in High-g MEMS Accelerometer

被引:0
|
作者
Geng, Zhenya [1 ]
Shen, Yi [1 ]
Zhang, Miao [1 ]
Li, Muhua [1 ]
Jin, Jing [1 ]
机构
[1] Harbin Inst Technol, Dept Engn & Controlling, Harbin 150006, Heilongjiang Pr, Peoples R China
关键词
Spring-mass structure; high-g MEMS accelerometer; resonant frequency; sensitivity capability;
D O I
暂无
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Spring-mass structure of high-g MEMS accelerometer is designed based on lumped-parameter analytical models and polymer film-beam constraints structure. The film-beam bone of spring-mass structure is used from silicon and organic polymer film material. The mechanical structure characteristic performs a sort of vibration flexibility to resonant frequency from its single proof-mass movement. According to the result of simulation and analysis, the parameters size of spring-mass structure is obtained to optimize on operational frequency and high-g range. At the same time, its sensitivity capability is improved to high-g MEMS accelerometer. Besides, stress curve and strain situation of the spring-mass structure are obtained by acceleration force opposing motion simulation. These simulation data describes elasticity architecture rationality of mechanical components, which provides favorable help to accomplish coating organic polymer film fabrication. The design and coating polymer fabrication can enhance robustness and stability to high-g MEMS accelerometer.
引用
收藏
页码:440 / 443
页数:4
相关论文
共 50 条
  • [1] Lattice Structure for a Critically Damped High-G MEMS Accelerometer
    Baldasarre, Leonardo
    Tocchio, Alessandro
    Urquia, Mikel Azpeitia
    Zerbini, Sarah
    2013 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2013,
  • [2] Fabrication and measurement of high-g MEMS accelerometer
    Shi Yunbo1
    )2 Department of Mechanical Engineering
    仪器仪表学报, 2008, (07) : 1345 - 1349
  • [3] Fabrication and measurement of high-g MEMS accelerometer
    Shi, Yunbo
    Liu, Jun
    Qi, Xiaojin
    Meng, Meiyu
    Yi Qi Yi Biao Xue Bao/Chinese Journal of Scientific Instrument, 2008, 29 (07): : 1345 - 1349
  • [4] Dynamic response of high-g MEMs accelerometer
    Zou, Hua
    Dandao Xuebao/Journal of Ballistics, 2010, 22 (01): : 100 - 102
  • [5] Simulation of the potting effect on the high-G MEMS accelerometer
    Yuqi Jiang
    Maohua Du
    Le Luo
    Xinxin Li
    Journal of Electronic Materials, 2004, 33 : 893 - 899
  • [6] Novel packaging technology for high-g MEMS accelerometer
    Jiao, Xin-Quan
    Chen, Jia-Bin
    Yin, Jing-Yuan
    Meng, Ding
    Zhongguo Guanxing Jishu Xuebao/Journal of Chinese Inertial Technology, 2013, 21 (04): : 536 - 539
  • [7] Study on the packaging technology for a high-G MEMS accelerometer
    Lou, X
    Shi, JJ
    Zhang, W
    Jin, YF
    PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 103 - 106
  • [8] Simulation of the potting effect on the high-G MEMS accelerometer
    Jiang, YQ
    Du, MH
    Luo, L
    Li, XX
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (08) : 893 - 899
  • [9] Design, fabrication and calibration of a high-G MEMS accelerometer
    Shi, Yunbo
    Zhao, Yongqi
    Feng, Hengzhen
    Cao, Huiliang
    Tang, Jun
    Li, Jie
    Zhao, Rui
    Liu, Jun
    SENSORS AND ACTUATORS A-PHYSICAL, 2018, 279 : 733 - 742
  • [10] HIGH-G SURVIVABLE MEMS THREE-AXIS ACCELEROMETER
    Hader, Grzegorz
    Smyth, Jefferey
    PROCEEDINGS OF ASME 2023 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, IMECE2023, VOL 12, 2023,