Thermal stress Analysis of Calibrating and Cooling Process for Plastic Profile in Calibrator

被引：0

作者：

Duan Lei ^{[1
]}

Zhang Yang ^{[1
]}

Jin Gang ^{[1
]}

Huo Wenguo ^{[1
]}

机构：

[1] Tianjin Univ Technol & Educ, Tianjin Key Lab High Speed Cutting & Precis Machi, Tianjin 300222, Peoples R China

来源：

2016 IEEE INTERNATIONAL CONFERENCE OF ONLINE ANALYSIS AND COMPUTING SCIENCE (ICOACS) | 2016年

关键词：

Calibrator; Plastic Profile; Thermal Stress; Thermo-mechanical Coupled;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The stress and strain of the plastic profile generated during its calibrating and cooling in the calibrator will result in the deformation of the profile. The reversed deformation design of the calibrator cavity is an effective method to solve this problem. The thermal stress of the profile during its calibrating and cooling in calibrator is analyzed by the thermo-mechanical coupled numerical simulation technology in this paper. The profile deformed and deformations are determined to do the theoretical reversed deformation design of the calibrator cavity. The deformations of the profile are mapped to the reversed deformation contour of the cavity. It is generally in agreement with the experiential reversed deformation design. The theoretical reversed deformation design of the cavity obtained according to the thermo-mechanical coupled analysis of the profile is verified correctness.

引用

页码：371 / 374

页数：4

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