Interaction of Cu-Al-Ni shape memory alloys particles with molten In and In plus Sn matrices

被引：8
|
作者：
Lopez, G. A. [1 ]
Barrado, M. [2 ]
Juan, J. M. San [2 ]
No, M. L. [1 ]
机构：
[1] Univ Basque Country, Dept Fis Aplicada 2, Fac Ciencias & Tecnol, E-48080 Bilbao, Spain
[2] Univ Basque Country, Dept Fis Mat Condensada, Fac Ciencias & Tecnol, E-48080 Bilbao, Spain
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2008年 / 495卷 / 1-2期
关键词：
Cu-Al-Ni shape memory alloy (SMA); Dissolution; Molten metal matrices; Intermetallic formation; Grain boundary penetration; In-Sn;
D O I：
10.1016/j.msea.2007.08.100
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Metal matrix composites for high-damping application were produced by embedding soft metallic matrices (pure In, In-10 wt.% Sri and In + Sri eutectic alloys) in powders of Cu-Al-Ni shape memory alloys (SMAs). During the composite production, the shape memory alloy particles interact with the molten matrices giving place to Cu dissolution from the shape memory alloy particles to the matrices, grain boundary penetration, and formation of intermetallic compounds. Adhesion, wetting and interfacial reaction are crucial for the final composites properties. Preliminary results on microstructural investigations performed applying optical and electron microscopy are presented in this contribution. The influence of thermal treatments on the microstructure of one composite is also discussed. (c) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码：304 / 309
页数：6
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