Electrical characteristics of contacts to thin film N-polar n-type GaN

被引:65
|
作者
Kim, Hyunsoo [1 ,2 ,3 ]
Ryou, Jae-Hyun [1 ,2 ]
Dupuis, Russell D. [1 ,2 ]
Lee, Sung-Nam [3 ,4 ]
Park, Yongjo [3 ]
Jeon, Joon-Woo [5 ]
Seong, Tae-Yeon [5 ]
机构
[1] Georgia Inst Technol, Ctr Cpds Semicond, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
[3] Samsung Electromech Co, Opto Syst Lab, Suwon 443743, South Korea
[4] Silla Univ, Dept Engn Energy & Appl Chem, Pusan 617736, South Korea
[5] Korea Univ, Dept Mat Sci & Engn, Seoul 136713, South Korea
关键词
annealing; etching; gallium compounds; III-V semiconductors; impurities; platinum; Schottky barriers; semiconductor thin films;
D O I
10.1063/1.3013838
中图分类号
O59 [应用物理学];
学科分类号
摘要
The electrical characteristics of metallization contacts to a thin film N-polar n-type GaN layer fabricated by a laser lift-off process combined with a dry etching are investigated. It is shown that for Pt Schottky contacts, the Schottky barrier height of the N-polar GaN is 1.27 eV, which is larger than that (1.23 eV) of reference Ga-polar GaN. Ti/Al Ohmic contacts to the N-polar GaN experience thermal degradation even at 400 degrees C. Such annealing-induced degradation is explained in terms of the presence of the complex surface states of the N-polar GaN, which consists of impurities and process-induced donorlike and acceptorlike defects.
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页数:3
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