Thermo-electric analysis of the interconnection of the LHC main superconducting bus bars

被引:1
|
作者
Granieri, P. P. [1 ,2 ]
Breschi, M. [3 ]
Casali, M. [3 ]
Bottura, L. [1 ]
Siemko, A. [1 ]
机构
[1] CERN, TE Dept, CH-1211 Geneva 23, Switzerland
[2] Swiss Fed Inst Technol EPFL, Particle Accelerator Phys Lab LPAP, Lausanne, Switzerland
[3] Univ Bologna, Dept Elect Engn DIE, I-40126 Bologna, Italy
关键词
Accelerator magnets; Interconnections; LHC; Superconducting bus bar;
D O I
10.1016/j.cryogenics.2012.05.009
中图分类号
O414.1 [热力学];
学科分类号
摘要
Spurred by the question of the maximum allowable energy for the operation of the Large Hadron Collider (LHC), we have progressed in the understanding of the thermo-electric behavior of the 13 kA superconducting bus bars interconnecting its main magnets. A deep insight of the underlying mechanisms is required to ensure the protection of the accelerator against undesired effects of resistive transitions. This is especially important in case of defective interconnections which can jeopardize the operation of the whole LHC. In this paper we present a numerical model of the interconnections between the main dipole and quadrupole magnets, validated against experimental tests of an interconnection sample with a purposely built-in defect. We consider defective interconnections featuring a lack of bonding among the superconducting cables and the copper stabilizer components, such as those that could be present in the machine. We evaluate the critical defect length limiting the maximum allowable current for powering the magnets. We determine the dependence of the critical defect length on different parameters as the heat transfer towards the cooling helium bath, the quality of manufacturing, the operating conditions and the protection system parameters, and discuss the relevant mechanisms. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:107 / 118
页数:12
相关论文
共 44 条
  • [1] Design and manufacture of the superconducting bus-bars for the LHC main magnets
    Belova, L
    Genet, M
    Perinet-Marquet, JL
    Ivanov, P
    Urpin, C
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2002, 12 (01) : 1305 - 1309
  • [2] Analysis of Defective Interconnections of the 13 kA LHC Superconducting Bus Bars
    Granieri, Pier Paolo
    Casali, Marco
    Bianchi, Marco
    Breschi, Marco
    Bottura, Luca
    Willering, Gerard
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2012, 22 (03)
  • [3] Thermo-Electric Design of the Protection and Diagnostic Feeders of the HL-LHC Triplets
    Pasdeloup, F.
    Prin, H.
    Williams, L.
    ADVANCES IN CRYOGENIC ENGINEERING, 2020, 755
  • [4] Link Element with Varying Conductance for Thermo-electric Analysis
    Murin, J.
    Kutis, V.
    Masny, M.
    INTERNATIONAL JOURNAL FOR COMPUTATIONAL METHODS IN ENGINEERING SCIENCE & MECHANICS, 2006, 7 (06): : 411 - 423
  • [5] Analysis software aids selection of thermo-electric cooler
    MacKenzie, E
    Fleury, T
    LASER FOCUS WORLD, 2003, 39 (01): : 69 - 71
  • [6] Vibration analysis and treatment for scuttles of a thermo-electric power station
    Jiang, Xiang-Hua
    Zhang, Hui
    Zhendong yu Chongji/Journal of Vibration and Shock, 2009, 28 (01): : 186 - 190
  • [7] Design, fabrication and feasibility analysis of a thermo-electric wearable helmet
    Lv, Song
    He, Wei
    Wang, Liping
    Li, Guiqiang
    Ji, Jie
    Chen, Hongbing
    Zhang, Gan
    APPLIED THERMAL ENGINEERING, 2016, 109 : 138 - 146
  • [8] Performance analysis of an integrated solar based thermo-electric and desalination system
    Aberuee, Mohammad Javad
    Baniasadi, Ehsan
    Ziaei-Rad, Masoud
    APPLIED THERMAL ENGINEERING, 2017, 110 : 399 - 411
  • [9] 3D thermo-electric analysis of the aluminum reduction cell
    Luo, Haiyan
    Lu, Jidong
    Huang, Lai
    Wu, Junqi
    Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), 2002, 30 (07):
  • [10] Transient Heat Transfer Analysis of Thermo-Electric Cooler Thermal Tools
    Sanchez, Jaime A.
    PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018), 2018, : 688 - 694