Nanowire-filled polymer composites with ultrahigh thermal conductivity

被引:86
|
作者
Balachander, Nikhil [1 ]
Seshadri, Indira [1 ]
Mehta, Rutvik J. [1 ]
Schadler, Linda S. [1 ,2 ]
Borca-Tasciuc, Theo [2 ]
Keblinski, Pawel [1 ]
Ramanath, Ganpati [1 ]
机构
[1] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA
[2] Rensselaer Polytech Inst, Dept Mech Aerosp & Nucl Engn, Troy, NY 12180 USA
基金
美国国家科学基金会;
关键词
INTERFACE MATERIALS; ELASTIC-MODULUS; NANOPARTICLES; MANAGEMENT;
D O I
10.1063/1.4793419
中图分类号
O59 [应用物理学];
学科分类号
摘要
Realizing high thermal conductivity nanocomposites is a challenge because of difficulties in incorporating high fractions of uniformly dispersed nanofillers and countering low filler-matrix interfacial conductance. Here, we obviate these issues by using <3 vol. % gold nanowire fillers to obtain a 30-fold increase in polydimethylsiloxane thermal conductivity that is 6-fold higher than any nanocomposite at low nanofiller loadings and exceeds theoretical predictions. The nanowire diameter and aspect ratio are keys to obtaining cold-welded networks that enhance thermal conductivity while fostering low modulus and electrical conductivity. Such nanowire nanocomposites are attractive for many applications in electronics, packaging, and energy devices. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4793419]
引用
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页数:5
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