共 50 条
- [1] Experimental and modeling study of high-viscosity silicone jet dispensing process for LED packaging 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 1431 - 1436
- [2] Precise Model of Phosphor Geometry Formed in Dispensing Process of LED Packaging 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 1077 - 1080
- [3] Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (07): : 1019 - 1026
- [4] Integration of Phosphor Printing and Encapsulant Dispensing Processes for Wafer Level LED Array Packaging 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1386 - 1392
- [5] Modeling of Laminar Fluid Flow in Jet Dispensing Process 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 276 - 279
- [6] Development Process of Phosphor Coating with Screen Printing for White LED Packaging 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 103 - 107
- [7] Reduction of Phosphor Precipitation in LED Packaging Process by Infrared Laser Curing Method IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (09): : 1440 - 1444
- [8] LED packaging by ink-jet microdeposition of high-viscosity resin and phosphor dispersion 2007 SID INTERNATIONAL SYMPOSIUM, DIGEST OF TECHNICAL PAPERS, VOL XXXVIII, BOOKS I AND II, 2007, 38 : 1603 - 1606
- [10] A Novel Process Obtaining Silicone Dome Lens for Wafer Level LED Packaging 2013 10TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING (CHINASSL), 2013, : 1 - 3