3D Composites: Opportunities & Challenges

被引:0
|
作者
Sugun, B. S. [1 ]
Sundaram, Ramesh [2 ]
机构
[1] Natl Aerosp Labs, CSIR, Bangalore, Karnataka, India
[2] Natl Aerosp Labs, CSIR, Adv Composites Div, Bangalore, Karnataka, India
关键词
WOVEN COMPOSITE; FAILURE MECHANISMS; TENSILE PROPERTIES; PART I; TEXTILE COMPOSITES; MATRIX COMPOSITES; ORTHOGONAL WEAVE; DAMAGE TOLERANCE; IMPACT DAMAGE; BEHAVIOR;
D O I
暂无
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
3D composites are creating a furore among the composites community, especially the aeronautics, space and defense sectors. Literature reports on 3D composites discuss a wide spectrum of 3D technologies encompassing weaving, stitching, braiding, tufting etc., that are at various stages of development and implementation. Choice of technology for a particular end use is based on various factors such as need, problem to be addressed, expected performance requirement, practicality of development and the like. Two broad areas of application for 3D composites are in the structural and thermal segments. Opportunities for 3D composites exist in the form of performance improvements for components having multidirectional stress states, simplified & radically different designs, reduced part count and reduced labor cost. Challenges that need to be addressed include achieving a balance between in-plane & out-of-plane properties, processing issues for thick & compact 3D structures, out-of-plane testing approaches and integration challenges with metal/2D composites. This paper reviews the current status and looks at what the future has to offer for this upcoming technology.
引用
收藏
页码:221 / 231
页数:11
相关论文
共 50 条
  • [1] Opportunities and challenges of translational 3D bioprinting
    Murphy S.V.
    De Coppi P.
    Atala A.
    Nature Biomedical Engineering, 2020, 4 (04) : 370 - 380
  • [2] New challenges and opportunities for 3D Integrations
    Michailos, J.
    Coudrain, P.
    Farcy, A.
    Hotellier, N.
    Cheramy, S.
    Lhostis, S.
    Deloffre, E.
    Sanchez, Y.
    Jouve, A.
    Guyader, F.
    Saugier, E.
    Fiori, V.
    Vivet, P.
    Vinet, M.
    Fenouillet-Beranger, C.
    Casset, F.
    Batude, P.
    Boeuf, F.
    Henrion, Y.
    Vianne, B.
    Collin, L. -M.
    Colonna, J. -P.
    Benaissa, L.
    Brunet, L.
    Prieto, R.
    Velard, R.
    Ponthenier, F.
    2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2015,
  • [3] Opportunities and Challenges of 3D NAND Scaling
    Goda, Akira
    2013 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS (VLSI-TSA), 2013,
  • [4] Opportunities and Challenges for 3D Systems and Their Design
    Emma, Philip
    Kursun, Eren
    IEEE DESIGN & TEST OF COMPUTERS, 2009, 26 (05): : 6 - 14
  • [5] 3D video communications: Challenges and opportunities
    Su, Guan-Ming
    Lai, Yu-Chi
    Kwasinski, Andres
    Wang, Haohong
    INTERNATIONAL JOURNAL OF COMMUNICATION SYSTEMS, 2011, 24 (10) : 1261 - 1281
  • [6] Key challenges and opportunities for 3D sequential integration
    Vandooren, A.
    Witters, L.
    Franco, J.
    Mallik, A.
    Parvais, B.
    Wu, Z.
    Li, W.
    Rosseel, E.
    Hikkavyy, A.
    Peng, L.
    Rassoul, N.
    Jamieson, G.
    Inoue, F.
    Verbinnen, G.
    Devriendt, K.
    Teugels, L.
    Heylen, N.
    Vecchio, E.
    Zheng, T.
    Waldron, N.
    Boemmels, J.
    De Heyn, V.
    Mocuta, D.
    Ryckaert, J.
    Collaert, N.
    2018 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2018,
  • [7] 3D food printing: nutrition opportunities and challenges
    Burke-Shyne, Suailce
    Gallegos, Danielle
    Williams, Tim
    BRITISH FOOD JOURNAL, 2021, 123 (02): : 649 - 663
  • [8] 3D Integration: Opportunities, Design Challenges and Approaches
    Knoechel, Uwe
    2012 IEEE 15TH INTERNATIONAL SYMPOSIUM ON DESIGN AND DIAGNOSTICS OF ELECTRONIC CIRCUITS & SYSTEMS (DDECS), 2012, : 4 - 4
  • [9] Modeling a 3D World - Challenges, Progress and Opportunities
    Belayneh, Tamrat
    SIXTH INTERNATIONAL SYMPOSIUM ON DIGITAL EARTH: MODELS, ALGORITHMS, AND VIRTUAL REALITY, 2010, 7840
  • [10] Challenges and opportunities in video coding for 3D TV
    Kalva, Hari
    Christodoulou, Lakis
    Mayron, Liam
    Marques, Oge
    Furht, Borko
    2006 IEEE INTERNATIONAL CONFERENCE ON MULTIMEDIA AND EXPO - ICME 2006, VOLS 1-5, PROCEEDINGS, 2006, : 1689 - +