Optoelectronic Package Having Low-Loss Optical Waveguide Hole With Core-Clad Structure for Chip-to-Chip Interconnection

被引：2

作者：

Takagi, Yutaka ^{[1
]}

Ohno, Takeshi ^{[1
]}

Horio, Toshikazu ^{[1
]}

Suzuki, Atsushi ^{[1
]}

Kojima, Toshifumi ^{[1
]}

Takada, Toshikatsu ^{[1
]}

Iio, Satoshi ^{[1
]}

Obayashi, Kazushige ^{[1
]}

Okuyama, Masahiko ^{[1
]}

机构：

[1] NGK Spark Plug Co Ltd, Komaki, Aichi 4858510, Japan

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 2008年 / 20卷 / 21-24期

关键词：

Core-clad structure; optical interconnection; optical waveguide holes; optoelectronic package; passive alignment;

D O I：

10.1109/LPT.2008.2006058

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We have developed optoelectronic packages having optical waveguide holes with core-clad structures for chip-to-chip optical interconnection within computer systems. A rate of 10-Gb/s/ch chip-to-chip optical signal transmission has been demonstrated. The optoelectronic package we have developed consists of two guide pins and four-channel optical waveguide holes. The two guide pins are used to align an optical fiber connector with an optical device. The optical waveguide holes are used to transmit optical signals vertically through the optoelectronic package. Using the optical waveguide holes in the optoelectronic package, and high-quality signal transmission has been achieved.

引用

页码：2033 / 2035

页数：3

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