Modification of the copper slab surface submicrorelief by applying high-density electric current

被引：1

作者：

Shcherbakov, IP ^{[1
]}

Churaev, DV ^{[1
]}

Svetlov, VN ^{[1
]}

机构：

[1] Russian Acad Sci, AF Ioffe Physicotech Inst, St Petersburg 194021, Russia

来源：

TECHNICAL PHYSICS | 2004年 / 49卷 / 04期

关键词：

Copper; Electric Current; Current Pulse; Periodic Structure; Specimen Surface;

D O I：

10.1134/1.1736927

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The modification of the copper slab surface submicrorelief by applying a current pulse of density higher than J(thr). The passage of a high-density current is shown to change the pattern of the copper slab polished surface, resulting in the formation of regular periodic structures. These structures are produced when moving dislocations emerge on the specimen surface. (C) 2004 MAIK "Nauka / Interperiodica".

引用

页码：516 / 519

页数：4

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