Influence of Reflow Soldering Process Parameters on the Lead-free Reflow Profile

被引：0
|
作者：
Liang, Wanlei [1 ]
Guan, Xiaodan [1 ]
Zhao, Peng [1 ]
机构：
[1] North China Inst Aerosp Engn, Dept Elect Engn, Langfang 065000, Peoples R China
来源：
MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4 | 2013年 / 690-693卷
关键词：
Reflow Soldering; Lead-free Soldering; Orthogonal Experimental Design; Reflow Profile; Reflow Soldering Process Parameters;
D O I：
10.4028/www.scientific.net/AMR.690-693.2578
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Reflow soldering process parameters have distinct effect on the lead-free reflow profile and its key indicators. To determine the relationship between reflow soldering process parameters and lead-free reflow profile is significant for obtaining the correct reflow profile. The result of orthogonal experimental shows that the most influential factors of the change rate of heat-up R-S are conveyor speed S, temperature set value of the heating zone 1 T-1 and the temperature set value of heating zone 2 T-2 in sequence; the most influential factors of the soaking time T-S are conveyor speed S, the temperature set value of heating zone 4 T-4 and the temperature set value of heating zone 2 T-2 in sequence; the most influential factors of the reflow peak temperature P-T are conveyor speed S, the temperature set value of heating zone 7 T-7 and the temperature set value of heating zone 6 T-6 in sequence; the most influential factors of the reflow time TAL are conveyor speed S and the temperature set value of heating zone 6 T-6 in sequence.
引用
收藏
页码：2578 / 2582
页数：5
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