Electromechanical Modelling of Modular Multilevel Converter Based HVDC System and Its Application

被引：0
|
作者：
Kou Longze [1 ]
Zhu Lin [2 ]
Li Fangyuan [2 ]
机构：
[1] Global Energy Interconnect Res Inst, State Key Lab Adv Power Transmiss Technol, Beijing, Peoples R China
[2] Global Energy Interconnect Res Inst, Beijing Key Lab DC Grid Technol & Simulat, Beijing, Peoples R China
来源：
2017 IEEE CONFERENCE ON ENERGY INTERNET AND ENERGY SYSTEM INTEGRATION (EI2) | 2017年
关键词：
MMC-HVDC; electromechanical modelling method; load flow model; transient stability model; additional control method; MMC;
D O I：
暂无
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
This paper introduces the electromechanical modelling method of modular multilevel converter based high voltage direct current (MMC-HVDC) system and studies the Chongqing-Hubei project based on the model. Firstly, the steady load flow model is established in this paper. Then, the transient stability model, which includes the AC side model, DC side model and control system model, is described in detail. For improving the transient stability, an additional control method, which combines a frequency controller and emergency power support strategy, is added on the control system model. Moreover, the modulation model is studied and discussed in case of fault conditions. The model is implemented on PSASP and its validity is verified through comparison with electromagnetic model. At last, the simulation is carried out based on the real grid date. The simulation results demonstrate the benefits of MMC-HVDC and the improvement in transient stability by applying the additional control method.
引用
收藏
页数：6
相关论文
共 50 条
  • [1] Electromechanical Transient Model of HVDC Grids Based on Modular Multilevel Converter
    [J]. 1600, Power System Technology Press (41):
  • [2] Modulation of Modular Multilevel Converter for HVDC application
    Solas, E.
    Abad, G.
    Barrena, J. A.
    Carcar, A.
    Aurtenetxea, S.
    [J]. PROCEEDINGS OF 14TH INTERNATIONAL POWER ELECTRONICS AND MOTION CONTROL CONFERENCE (EPE-PEMC 2010), 2010,
  • [3] A startup strategy for modular multilevel converter based HVDC system
    Hua, Wen
    Zhao, Xiaoming
    Huang, Xiaoming
    Shen, Bin
    Li, Yong
    Li, Jihong
    [J]. Dianli Xitong Zidonghua/Automation of Electric Power Systems, 2015, 39 (11): : 51 - 57
  • [4] Electromechanical transient modelling and application of modular multilevel converter with embedded energy storage
    Yu, Zheyang
    Zhang, Zheren
    Xu, Zheng
    [J]. IET GENERATION TRANSMISSION & DISTRIBUTION, 2022, 16 (01) : 123 - 136
  • [5] A novel modular multilevel converter modelling technique based on semi-analytical models for HVDC application
    Zama, Ahmed
    Bacha, Seddik
    Benchaib, Abdelkrim
    Frey, David
    Silvant, Sebastien
    [J]. JOURNAL OF ELECTRICAL SYSTEMS, 2016, 12 (04) : 649 - 659
  • [6] Electromechanical Transient Modeling of Modular Multilevel Converter Based Multi-Terminal HVDC Systems
    Liu, Sheng
    Xu, Zheng
    Hua, Wen
    Tang, Geng
    Xue, Yinglin
    [J]. IEEE TRANSACTIONS ON POWER SYSTEMS, 2014, 29 (01) : 72 - 83
  • [7] Control and Modulation Strategies for Modular Multilevel Converter based HVDC System
    Guan, Minyuan
    Xu, Zheng
    Chen, Hairong
    [J]. IECON 2011: 37TH ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS SOCIETY, 2011,
  • [8] Control of a modular multilevel converter-based HVDC transmission system
    Soto-Sanchez, D.
    Green, T. C.
    [J]. PROCEEDINGS OF THE 2011-14TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE 2011), 2011,
  • [9] Electromechanical Transient Modeling of Modular Multilevel Converter Based Multi-Terminal HVDC Systems
    Liu, Sheng
    Xu, Zheng
    Hua, Wen
    Tang, Geng
    Xue, Yinglin
    [J]. 2014 IEEE PES GENERAL MEETING - CONFERENCE & EXPOSITION, 2014,
  • [10] Application of Modular Multilevel Converter for HVDC Transmission with Selective Harmonics
    Baroni, B. R.
    Mendes, M. A. Severo
    Cortizo, P. C.
    Lisboa, A. C.
    Saldanha, R. R.
    [J]. 39TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY (IECON 2013), 2013, : 6195 - 6200
12345