Borderless via clean study for minimizing Al-Cu loss in 58nm flash devices

被引：0
|
作者：
Chen, Cheng-Kuen [1 ]
Yu, Pi-Chun [1 ]
Lee, Ming-Hsiu [1 ]
Wu, Chih-Ning [1 ]
Hiroshi, Matsuo [1 ]
机构：
[1] Powerchip Semicond Corp, Hsinchu, Taiwan
来源：
ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES IX: UCPSS 2008-9TH INTERNATIONAL SYMPOSIUM ON ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES (UCPSS) | 2009年 / 145-146卷
关键词：
Borderless Via; Al-Cu undercut;
D O I：
10.4028/www.scientific.net/SSP.145-146.357
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：357 / 360
页数：4
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