共 50 条
- [1] CHARACTERIZATION AND CURING OF MICROELECTRONICS ENCAPSULANTS ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1988, 196 : 136 - PMSE
- [2] POLYMER ENCAPSULANTS FOR MICROELECTRONICS - MECHANISMS FOR PROTECTION AND FAILURE IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1988, 11 (01): : 152 - 158
- [4] POLYMER ENCAPSULANTS FOR MICROELECTRONICS: MECHANISMS FOR PROTECTION AND FAILURE. IEEE transactions on components, hybrids, and manufacturing technology, 1987, 11 (01): : 152 - 158
- [5] MICROELECTRONICS - JUST HOW RELIABLE IS RELIABLE CONTROL AND INSTRUMENTATION, 1984, 16 (10): : 7 - 7
- [6] Photopolymerizable encapsulants for microelectronic devices RADTECH'98 NORTH AMERICA UV/EB CONFERENCE PROCEEDINGS, 1998, : 712 - 718
- [7] POLYMERIC FOAM ENCAPSULANTS FOR ELECTRONIC DEVICES ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1983, 185 (MAR): : 65 - ORPL
- [9] Challenges to realize highly reliable SiC power devices 2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2018,
- [10] High Quality Test Methodology for Highly Reliable Devices 2019 IEEE INTERNATIONAL TEST CONFERENCE (ITC), 2019,